New Electronics

Keysight launches 3D interconnect design tool for advanced chiplet and 3DIC packages

Keysight Technologies has introduced a new software tool aimed at tackling the growing complexity of 3D interconnect design in high‑density chiplet and 3DIC packages. 3D interconnect design tool ...
Barron's

Unity Foods Ltd.

Unity Foods Ltd. engages in the procurement and crushing of multiple oil seeds. It operates through the following segments: Edible Oil, Animal Feed, Specialty Fats. The Edible Oil segment includes ...
IEEE

Die-Level Transformation From 2D Shuttle Chips to 3D-IC With TSV for Advanced Rapid Prototyping Methodology With Meta Bonding

Abstract: 3D-IC technology, it may be more appropriate to refer to this as TSV (Through-Si Via) formation technology, has been maturing year by year and is increasingly utilized in advanced ...
IEEE

Advanced Image-Based Methods for 3D Semantic Segmentation of Lidar Point Clouds in Electrical Infrastructure Applications

The acquisition of 3D LiDAR point cloud data combined with images is becoming increasingly common in geomatics, particularly for updating geographic databases [1]. A key application is the inspection ...
GitHub

An advanced 3D Gaussian Splatting renderer for THREE.js

Version 2.0 is a major rewrite of the renderer to enable huge worlds made of dynamic 3D Gaussian Splats. It's a complete solution for creating, streaming, and rendering huge 3DGS worlds on the web on ...