Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Figure 1. Ultrasonic testing using pulse echo and through-transmission methods. Pulse echo (left and center) uses a transducer that sends and receives ultrasound energy, producing both A- and B-scan ...

# Fuel cells, integral components of hydrogen fuel cell electric vehicles(FCEVs), serve as eco-friendly energy conversion systems that generate electric power and ...

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...

This diagram depicts how metals with a smoother surface are less prone to the accumulation of hydrogen-induced defects, namely dislocations and vacancy clusters. As the world strives to achieve carbon ...

Hidden semiconductor defects often pass inspection but fail later in operation. Learn how latent defects form, evade ...