As technology nodes shrink to 90 nanometers and below, chips become much more difficult to manufacture. In-die process variations increase substantially at 90 nm — even more at 65 nm. If these effects ...

Venice, Florida &@8212 Solido Design Automation has introduced a scalable and extensible solution for meeting design challenges created by process variations at nanometer feature sizes. The new ...

As the need to scale transistors to ever-smaller sizes continues to press on technology designers, the impact of parasitic resistance and capacitance can approach or even outpace other aspects of ...

The effect of low-k spacer thickness variation to select the best combination of spacer thickness and S/D epi shape to improve speed and power performance. In this paper, we explore an end-to-end ...

With semiconductor feature sizes continuing to shrink, the variability arising from process technologies such as strained silicon, as well as the manufacturing processes themselves at 45 nm and below, ...