JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

Intel recently demonstrated a new type of DIMM memory technology called Multiplexer Combined Rank (MCR), also referred to as MRDIMMs, that provides up to 2.3X better performance for HPC workloads and ...

Smart memory node device from UniFabriX is designed to accelerate memory performance and optimize data-center capacity for AI workloads. Israeli startup UniFabriX is aiming to give multi-core CPUs the ...

Ever since AMD introduced Zen, all CPUs based on the architecture have shown that they are especially sensitive to memory speed, as well as other timings. Using faster RAM could give a sizable ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Altera Corporation, a leader in FPGA innovations, today announced production shipments of its Agilex™ 7 FPGA M-Series, the industry's first high-end, high-density ...

In context: The first iteration of high-bandwidth memory (HBM) was somewhat limited, only allowing speeds of up to 128 GB/s per stack. However, there was one major caveat: graphics cards that used ...

In an attempt to troubleshoot an issue with low 3DMark scores, (that I have since fixed) I downloaded SiSoft Sandra to make sure my RAM was performing up to par. However, every time but one that I've ...

In advance of Supercomputing '22 in Dallas, Intel Corporation has introduced the Intel Max Series product family with two leading-edge products for high performance computing (HPC) and artificial ...