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Next-generation 3D DRAM approaches reality as scientists achieve 120-layer stack using advanced deposition techniques

Imagine trying to build a tower out of hundreds of very thin, slightly different sheets of material, where each sheet wants to bend or warp on its own. That’s essentially what researchers at imec and ...
Semiconductor Engineering

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...