It’s the tale of two promising and separate 3D chip architectures. One technology is slowly taking root, while the other one is heating up. 3D stacked-die using through-silicon vias (TSVs) is on the ...
The multiple demands of 3D NAND to enable yield and performance increase in difficulty at each generation. First generation devices, at 24-32 layer pairs, pushed process tools to extremes, going ...
Canon launched its Nanoimprint Lithography semiconductor manufacturing equipment, which has the potential to compete with ASML's EUV technology currently in production at 4nm. Canon's first planned ...
(Nanowerk News) Nanotechnology and nanoscience are enabled by nanofabrication. Electron-beam lithography (EBL), which makes patterns down to a few nanometers, is one of the fundamental pillars of ...
SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of ...
Soft lithography facilitates the fabrication of intricate three-dimensional patterns and structures at both microscale and nanoscale dimensions. Diverging from photolithography, a technique commonly ...
Nanotechnology and nanoscience are enabled by nanofabrication. Electron-beam lithography (EBL), which makes patterns down to a few nanometers, is one of the fundamental pillars of nanofabrication. In ...
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